PVA Tepla GIGAbatch 690

PVA Tepla GIGAbatch 690

Packaging assembly laboratory / Underfill / Plasma etch

PVA Tepla GIGAbatch 690

Supplier :

Model :

Purpose :

Cleaning of advanced chip packages using oxygen or argon plasma

CAPABILITY:

Process chamber:

Material Aluminum

Volume 91 liters

Inner dim. 450 x 450 x 450 mm ( H x W x D)

Plasma generation and gas flow: Large area, microwave plasma generation

No electrodes inside chamber

Gas flow variable depending of application

Plasma generation through right side chamber wall

Exhaust in left side chamber wall

Vacuum system: Ultimate pressure ≤ 10 -1 mbar

Process pressure approx. 0,2 – 1,5 mbar

Microwave plasma generator: Continuously adjustable magnetron, air cooled

Frequency 2.45 Gigahertz

Maximum output 1000 Watts

Rotating platform:

Material Aluminum, 350 mm Ø

Electrical drive starts after the process chamber is closed

Mass flow controller, up to 4 gaz channels possible. Currently O2 and Argon

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