CAPABILITY: Sample up to 25 mm Ø In-Situ coating of SEM and TEM sample with various target material Surface cleaning,
CAPABILITY: Cutting Rough cutting max sample size :50 X 50 cm Precision cutting : 160 X 50 mm / 70
CAPABILITY: Electro optical terahertz pulse reflectometry Non-destructive rapid fault isolation Locating faults within the device under test Fault position accuracy
CAPABILITY: Bulk glasses, polymers, plastics, garnets and other materials (both rigid and flexible) including liquids No matching fluids required Determination
CAPABILITY: Resolution: < 0.6 um resolution: 0.5 micron feature recognition X-ray source: Up to 150keV Field of View: 0.65mm x
CAPABILITY: Time Domain Reflectometry: 80E04 TDR Sampling Module (20Ghz) 80E10 TDR Sampling module (50GHz) Q-factor Extinction Ratio Signal-to-noise Ratio Wide
CAPABILITY: The 20W Model 2400 SourceMeter® instrument allows sourcing and measuring voltage from ±5µV (sourcing) and ±1µV (measuring) to ±200V
CAPABILITY: OHMS 9 ranges: 10 Ù to 1GÙ Two-wire and four-wire Ohms with offset compensation Up to 50,000 readings/sec (5.5
CAPABILITY: Time Domain Reflectometry: 80E04 TDR Sampling Module (20Ghz) 80E10 TDR Sampling module (50GHz) Q-factor Extinction Ratio Signal-to-noise Ratio Wide
CAPABILITY: High Precision Measurements of Semiconductor Devices Up to 2000 Volts or 10 Amp Sourcing Up to 220 Watts 1