CAPABILITY: X-ray column: Max Voltage 160 kV Max Current 600µA Sub-micron imaging resolution 3 focusing mode (nanoFocus, microFocus, High Power)

Underfill for flip chip and chip scale packaging Chip encapsulation Dam and fill Thermal compounds Exterior bulk fluid reservoir Tactile

CAPABILITY: MultiMEGTM Megasonic generator:  2 central frequencies available (430kHz or 1.3MHz) with a sweep of 1% around the central frequency

Capability: Surface free from  contact point Chamber dimension 7 x 23 x 69.5 inches ( D x H x W