IMAPS 2016, Pasadena

IMAPS 2016, Pasadena

IMAPS 2016, Pasadena

30 September 2016
News

Welcome to IMAPS 2016, Pasadena — Packaging the Connected World —
the 49th International Symposium on Microelectronics!

IMAPS Pasadena is the LARGEST Conference Program for Microelectronics,
Assembly, 2.5/3D, Emerging Applications, Materials &
Advanced Packaging in the FALL of 2016:
3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers!!

— Packaging the Connected World —

the 49th International Symposium on Microelectronics! IMAPS Pasadena is the LARGEST Conference Program for Microelectronics,

Assembly, 2.5/3D, Emerging Applications, Materials

&  Advanced Packaging in the FALL of 2016: 3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers!!

Back to news list >
Copyright © 2023 C2MI, All rights reserved.

As you navigate through our site, certain cookies may be stored in or retrieved from your browser. This information may relate to you, your preferences or your device and is primarily used to ensure that the site functions correctly. The information does not identify you directly, but may help you benefit from an enhanced Web experience. Because we respect your privacy, we give you the opportunity not to allow these cookies.

Accept Preferences Decline
Close Popup
Privacy Settings saved!
Privacy settings

As you navigate through our site, certain cookies may be stored in or retrieved from your browser. This information may relate to you, your preferences or your device and is primarily used to ensure that the site functions correctly. The information does not identify you directly, but may help you benefit from an enhanced Web experience. Because we respect your privacy, we give you the opportunity not to allow these cookies.

Required Analytics
Technical cookies
To use this website, we use the following cookies which are technically necessary
  • wordpress_test_cookie
  • wordpress_logged_in_
  • wordpress_sec
Decline
Save
Accept