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That the manufacture of MEMS require the creation of very deep holes like a drill rig does?

At C2MI, the Versalis tool from SPTS has several chambers allowing different types of plasma etchings. The Rapier module, used for Deep Reactive Ion Etching of silicon. Using a patented dual plasma source with independently controlled primary and secondary decoupled plasma zone, the etching rate in this chamber can reach 17 um per minute. Fully vertical 90-degrees profiles are achievable with aspect ratios up to 100 to 1.

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