At C2MI, the Versalis tool from SPTS has several chambers allowing different types of plasma etchings. The Rapier module, used for Deep Reactive Ion Etching of silicon. Using a patented dual plasma source with independently controlled primary and secondary decoupled plasma zone, the etching rate in this chamber can reach 17 um per minute. Fully vertical 90-degrees profiles are achievable with aspect ratios up to 100 to 1.
As you navigate through our site, certain cookies may be stored in or retrieved from your browser. This information may relate to you, your preferences or your device and is primarily used to ensure that the site functions correctly. The information does not identify you directly, but may help you benefit from an enhanced Web experience. Because we respect your privacy, we give you the opportunity not to allow these cookies.
As you navigate through our site, certain cookies may be stored in or retrieved from your browser. This information may relate to you, your preferences or your device and is primarily used to ensure that the site functions correctly. The information does not identify you directly, but may help you benefit from an enhanced Web experience. Because we respect your privacy, we give you the opportunity not to allow these cookies.
