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Too much stress is as bad for MEMS as it is for humans? I

The moving parts of a MEMS must be at low mechanical stress to avoid deformation when they are released and freed of movement. A thin layer is governed by internal forces, either in tension or in compression. C2MI uses a unique LPCVD manufacturing process for low-stress silicon nitride and polysilicon films deposition. These layers are deposited using vertical AVP furnaces from SPT Microtechnologies. The deposited thickness can be as thin as 150 nm or be several micrometres thick with a within wafer thickness non-uniformity of 3% or better.

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