Lintec RAD 2000m12

Lintec RAD 2000m12

Packaging assembly laboratory / Wafer Dicing / UV expose

Lintec RAD 2000m12

Supplier :

Model :

Purpose :

Reduce dicing tape adhesive strength

CAPACITY:

Irradiation on a section of wafer: 310 mm Ø

Irradiation over the entire surface: 382 mm Ø

Applicable frame dimension: 300 mm Ø, SEMI standard or equivalent

Lamp:

HHL-2800 / B-FL
type without ozone
dominant wavelength of 365 nm
maximum power of 2.8 kW

UV illuminator: 120 mW / cm2

Oxygen concentration during irradiation: 5% or less

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