Integrated microsystems laboratory (MEMS) / Dry etching / Silicon etch
SPTS Versalis Rapier Module
Supplier :
SPTS
Model :
Versalis FxP - Rapier module
Purpose :
Silicon Dry etch
CAPABILITY:
SI DRIE module
- Patented dual plasma source with indepemdently controlled primary and secondary decoupled plasma zones
- Excellent uniformity
Material: Si Aspect Ratio: Up to 40:1 Etch rate: Up to 8µm/min Profile angle: From 88° to 92° ± 0.1°
