SPT Micro AVP-9200

Blog Archives

CAPABILITY: Thermal oxide thickness: 140 ± 6 nm, and 900 ± 20 nm Within wafer thickness non-uniformity: 0.5% (1 sigma)

7 February 2017

CAPABILITY: Wafer size: 200 mm Production wafers per load: 50 Thickness range of wafers: 300 – 1700 µm Temperature range: 

7 February 2017

CAPABILITY: Wafer size: 200 mm Production wafers per load: 50 Thickness range of wafers: 300 – 1700 µm Temperature range: 

7 February 2017