Our DW-3000 maskless aligner achieves a throughput of >30 wafers per hour (1 laser head). Since the tool do not

CAPABILITY Single chamber DUV Phototabilizer; Compatible with 200mm and 150mm wafers sizes; UV Bake process applications; Irradiator contains Hg high

CAPABILITY: 5X Stepper Aligner Resolution down to 350 nm Front-to-front alignment: 50 nm, 3 sigma Back-to-back alignment: 80 nm, 3

CAPABILITY Wafer size: 200 mm Production wafers per load: 50 Thickness range of wafers: 300 – 1700 µm Temperature range: 

CAPACITY Wafer size 200mm Production wafers per load: 50 Thickness range of wafers: 300 – 1700 µm Temperature range:  20

CAPACITY Has direct interface with ASML stepper Adapted to spin-coat negative tone and positive tone resists KMPR-1005 (1002), with 90°