CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating

CAPABILITY: Fast scanning and precise scan fixture positioning for higher throughput Jedec tray size transfer  fixture L shaped tank with

CAPABILITY: Integrated input and output elevators load and unload stacked  tray Inertially balanced for vibration free and shock free operation

CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,

CAPABILITY: Process chamber: Material Aluminum Volume 91 liters Inner dim. 450 x 450 x 450 mm ( H x W

CAPABILITY:  Semi-Automatic equipment Automatic alignment of substrate position and dispense Manually load/unload substrate on the dispense stage Substrate: min size

CAPABILITY  Working volume 21’’ H x 14.5’’ W x 27 ‘’D 9 quartz shelves in the chamber Electrode on chamber

CAPABILITY: Handling wafer with diameter up to 200 mm Maximum batch of 50 200 mm wafers Chamber Cleanliness of Class 1

CAPABILITY: Gantry drive system, closed-loop DC, servo ball screw drive Work area in X-Y direction 18 x 18 inches Actual

CAPABILITY: High speed, uniform plasma cleaner Parallel plate RF back-sputtering method O2 (option Ar) High frequency power source 100 W