CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating
CAPABILITY: Fast scanning and precise scan fixture positioning for higher throughput Jedec tray size transfer fixture L shaped tank with
CAPABILITY: Integrated input and output elevators load and unload stacked tray Inertially balanced for vibration free and shock free operation
CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,
CAPABILITY: Process chamber: Material Aluminum Volume 91 liters Inner dim. 450 x 450 x 450 mm ( H x W
CAPABILITY: Semi-Automatic equipment Automatic alignment of substrate position and dispense Manually load/unload substrate on the dispense stage Substrate: min size
CAPABILITY Working volume 21’’ H x 14.5’’ W x 27 ‘’D 9 quartz shelves in the chamber Electrode on chamber
CAPABILITY: Handling wafer with diameter up to 200 mm Maximum batch of 50 200 mm wafers Chamber Cleanliness of Class 1
CAPABILITY: Gantry drive system, closed-loop DC, servo ball screw drive Work area in X-Y direction 18 x 18 inches Actual
CAPABILITY: High speed, uniform plasma cleaner Parallel plate RF back-sputtering method O2 (option Ar) High frequency power source 100 W
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