Application fields: 8in wafer compression molding equipment for Fan-out wafer-level packaging (FOWLP) and heterogeneous integration Molding of reconstituted wafers (D2W)

CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating

CAPABILITY: Integrated input and output elevators load and unload stacked  tray Inertially balanced for vibration free and shock free operation

CAPABILITY: Handling wafer with diameter up to 200 mm Maximum batch of 50 200 mm wafers Chamber Cleanliness of Class 1

CAPABILITY: Fast scanning and precise scan fixture positioning for higher throughput Jedec tray size transfer  fixture L shaped tank with

CAPABILITY: High speed, uniform plasma cleaner Parallel plate RF back-sputtering method O2 (option Ar) High frequency power source 100 W

CAPABILITY: XY placement accuracy +/- 75 µm @ 3 sigma Encoder resolution 2 µm Speed 500 mm/sec Gantry drive system,

CAPABILITY: Input/output Jedec tray Multiple axes (Cartesian) gantry system with two independents heads. X-Y placement accuracy +/- 50 µm Encoder

CAPABILITY: Internal chamber volume 11 cubic feet 38 x 20 x 26 inches (W x D x H) Chamber interior,

CAPABILITY: Stainless steel vacuum chamber 18 W x24 H x 18 D inches One electrode technology shelf-sets with 14 positions