CAPABILITY: Fully automatic wire bonder Cassette in/out Typical ultra-fine pitch ball grid array product 45µm pad pitch 65 msec wire
CAPABILITY: JEDEC tray input/output Max conveyor capacity 2.2 Kg Digital pattern recognition system for optical registration of the dispense site
CAPABILITY: Operation in manual or semi-automatic mode XYZ axes encoder precision: 0.0003” linear per motor step Die placement precision of
CAPABILITY: JEDEC tray input/output Accuracy +/- 10 µm @ 3 sigma, cpk 1.33 Theta axis rotary bond head 0˚ to
CAPABILITY: JEDEC tray input/output Accuracy +/- 3 µm @ 3 sigma cpk 1.33 Automatic calibration function to correct thermal changes
CAPABILITY: Ideal for product and process development Placement, thermo compression bonding capable Forming gas and formic acid available Automated pattern