CAPABILITY: Dot placement accuracy at full speed : ±35µ at 3 sigma Product processing of >900mm Contact and non-contact heating
CAPACITY: 200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage
Applications field : Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing Specifications : Fully automated mode Process Wavelength: IR
CAPACITY: Automatic mode Working area (x, y, z) : 100 x 115 x 42 mm Axis accuracy : ±10 µm Heated working
CAPABILITY: X-ray column: Max Voltage 160 kV Max Current 600µA Sub-micron imaging resolution 3 focusing mode (nanoFocus, microFocus, High Power)
Applications Transmission System Test: Polarization Sensitivity Analysis on Link / Transmission Quality Recirculating Loop Experiments: Loop-Synchronous Polarization Scrambling Interferometry: Polarization
CAPABILITY: 1 high-end adjustable laser source Up to 4 compact modules (power supply, adjustable or fixed laser) Integrated applications (passive
CAPABILITY: N4903B-C13: Pattern generator and error detector up to 12.5Gb/s N4876A: Mutliplexer 2:1 allowing to test data rates up to
CAPABILITY: 81980A: Compact tunable laser. S+C band, high performance 81663A-131: DFB Laser Source Module, 1310nm, 20mW 81663A-149: DFB Laser Source
CAPABILITY: N4375B-102: Dual wavelength source. 1310 and 1550nm N4375B-314: 20GHz, 4 port PNA-X N4375B-021: Straight fiber interface, single-mode N4375B-050: Testset