Primaxx fxP (VHF) Batch processing module (up to 25 200 mm wafers) Oxide etch rates: 0.1 à 10 um/min Oxide

CAPABILITY: Metal etch module Patented high density plasma source incorporating a radial coil design

CAPABILITY: Isopod – in-situ resist removal In-situ strip for corrosion prevention Isotropic polyimide removal (dry release)

CAPABILITY: Dielectric etch module Tailored  chamber design to increase the process stability Plasma density necessary for the successful etching of

CAPABILITY: SI DRIE module Patented dual plasma source with indepemdently controlled primary and secondary decoupled plasma zones Excellent uniformity Material:

CAPABILITY: Choice of plasma sources Forming gas 3.5% provides the advantage of catalysis for generation of atomic oxygen in plasma