Primaxx fxP (VHF) Batch processing module (up to 25 200 mm wafers) Oxide etch rates: 0.1 à 10 um/min Oxide
Our DW-3000 maskless aligner achieves a throughput of >30 wafers per hour (1 laser head). Since the tool do not
Stealth dicing is a laser-based technique to dice silicon wafers. This technique has several benefits. Among others, it’s a dry
CAPABILITY: Dry-in/dry-out automated SMIF pod input/output operation; Mini-environment within wet bench secures class 1 clean room performance on the wafer
CAPABILITY: Metal etch module Patented high density plasma source incorporating a radial coil design
CAPABILITY: Film thickness: 135 ± 6.7 nm, and 300 ± 45 nm Within wafer thickness non-uniformity: 1 % (1 sigma)
CAPABILITY: Wafer size: 200 mm Thickness range of wafers: 300 – 1200 µm Temperature range: 100 – 400 °C Pressure
CAPABILITY: Thermal oxide thickness: 140 ± 6 nm, and 900 ± 20 nm Within wafer thickness non-uniformity: 0.5% (1 sigma)
CAPABILITY: Film thickness: 300 ± 30 nm, and 2000 ± 200 nm Within wafer thickness non-uniformity: 2.5% (1 sigma) Wafer-to-wafer
CAPABILITY: Film thickness: 330 ± 15 nm, 1550 ± 50 nm, and 2050 ± 75 nm Within wafer thickness non-uniformity:
