Primaxx fxP

Blog Archives

Primaxx fxP (VHF) Batch processing module (up to 25 200 mm wafers) Oxide etch rates: 0.1 à 10 um/min Oxide

16 March 2020

Stealth dicing is a laser-based technique to dice silicon wafers. This technique has several benefits. Among others, it’s a dry

7 February 2019

CAPABILITY: Dry-in/dry-out automated SMIF pod input/output operation; Mini-environment within wet bench secures class 1 clean room performance on the wafer

11 February 2017

CAPABILITY: Thermal oxide thickness: 140 ± 6 nm, and 900 ± 20 nm Within wafer thickness non-uniformity: 0.5% (1 sigma)

7 February 2017