Applications field : Wafer edge grinding Wafer terrace bevelling Wafer coring post processing of edges   Specifications Fully automated mode

CAPACITY:  200mm wafers Pneumatic ram with speed control and 3″ adjustable stroke Motorized circular cutter assembly Digital temperature-controlled heated stage

Applications field :  Contact-less dicing of Silicon wafers  PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing    Specifications :  Fully automated mode  Process Wavelength: IR 

CAPACITY: Irregular slices up to 300mm with solder balls or wire solder site Slices of glass, ceramics, overlays, SiC, Sapphire,

CAPACITY: Irradiation on a section of wafer: 310 mm Ø Irradiation over the entire surface: 382 mm Ø Applicable frame

CAPABILITY: Electronic wafer map Conversion to make software compatible with ALPS wafer map Wafer expending film frame or ring holder

CAPACITÉ: Lampe UV multi faisceaux de 365nm Rainure simple passe de 60 µm de large Capacité d’épaisseur d’échantillon jusqu’à 1.5mm

CAPACITY: Automatic slice support: 200 and 300mm Thickness from 800µm to 190µm Maximum number of bump / slice: 10 million

CAPABILITY: Ultra-thin automated wafer handling Automatic peeling and dicing frame  (FF123) mounting Chemical/Mechanical polishing station  0.15 µm roughness TTV  without

CAPACITÉ: Ajustement manuel de la tranche et de son cadre Application du film, découpe et retrait de l’excédent en mode