Integrated microsystems (MEMS) laboratory

Integrated microsystems (MEMS) laboratory

Microelectromechanical systems (MEMS) are from a technology that combines microcircuits with tiny mechanical devices such as sensors, valves, mirrors, gears, or incorporated directly triggers the semiconductor. C2MI MEMS laboratory has class 10/Iso 4 clean rooms and class 1 clean rooms for the wafer surface. The infrastructure is suitable for both the micro-machining surface layer and the silicon ones.

Metrology

Inspection Infrared: multilayer and overlay measurement
Pattern recognition and thin film metrology
Inspection visible range: particle and defect count

Photoresist Stripping and Ashing

Lift-off

Dry lift-off and detaping

Thin film deposition

Low pressure chemical vapour deposition / LSN
Plasma enhanced chemical vapour deposition
Diffusion / Oxidation
Low pressure chemical vapour deposition / TEOS
Low pressure chemical vapour deposition / ISDP

Chemical / Mechanical Polishing

Polishing and planarisation

Wafer handling

Transfer system

Bonder

Wafer bonding

Plating

Electrodeposition of metal and dielectric

Thermal treatment

Anneal
Sub-atmospheric pressure / Bake anneal
High vacuum bake

Wet etching

Wafer cleaning
Silicon etch
Oxide, nitride, aluminium etch

Dry etching

Release Etch
Metal etch
02 plasma polymers strip
Dielectric etch
Silicon etch
02 plasma polymers strip

RESEARCH

Keywords
Category