Microelectromechanical systems (MEMS) are from a technology that combines microcircuits with tiny mechanical devices such as sensors, valves, mirrors, gears, or incorporated directly triggers the semiconductor. C2MI MEMS laboratory has class 10/Iso 4 clean rooms and class 1 clean rooms for the wafer surface. The infrastructure is suitable for both the micro-machining surface layer and the silicon ones.

Metrology
Inspection Infrared: multilayer and overlay measurement
Pattern recognition and thin film metrology
Inspection visible range: particle and defect count
Lithography
Maskless Aligner
Deep UV
5X Stepper aligner
Hard Bake
Molecular vapour deposition
Coater/Developer
Photoresist Stripping and Ashing
Resist strip
Resist strip
Resist strip
Lift-off
Dry lift-off and detaping
Thin film deposition
Low pressure chemical vapour deposition / LSN
Plasma enhanced chemical vapour deposition
Diffusion / Oxidation
Low pressure chemical vapour deposition / TEOS
Low pressure chemical vapour deposition / ISDP
Chemical / Mechanical Polishing
Polishing and planarisation
Wafer handling
Transfer system
Bonder
Wafer bonding
Plating
Electrodeposition of metal and dielectric
Thermal treatment
Anneal
Sub-atmospheric pressure / Bake anneal
High vacuum bake
Wet etching
Wafer cleaning
Silicon etch
Oxide, nitride, aluminium etch
Dry etching
Release Etch
Metal etch
02 plasma polymers strip
Dielectric etch
Silicon etch
02 plasma polymers strip