Packaging assembly and tests

Packaging assembly and tests

SEMICONDUCTOR ASSEMBLY LABORATORY

C2MI offers a wide range of equipment to conduct the advanced packaging of semiconductors as a finished product on a substrate ready for assembly to the card. The integrated circuit (IC), also called electronic chip is an electronic component reproducing one or more electronic function more or less complex, often incorporating several basic types of electronic components in a small volume, making it easy to circuit work. There is a wide variety of these components divided into two categories: analog and digital.

Others

2D X-Ray
Adhesive / thermal paste dispense
Chemical stripper and DI water rinse
Horizontal sputter

Wirebond assembly

Wire bond
Discrete component placement

Wafer Dicing

Wafer Dicing
Wafer Dicing
Stealth Dicer
Wafer Dicing
UV expose
Manipulation
Laser ablation 2
Wafer inspection (scanner)
Wafer thinning
Semi-automatic wafer and frame mounter

Balling

Ball placement
Balling flux cleaning
High vacuum bake
Transfer system

Underfill

Dispenser encapsulation
Underfill dispenser
Acoustic microscopy
High vacuum cure oven
Acoustic microscopy
Plasma etch
Underfill dispenser
Underfill dispenser
Photonic curing
Plasma etch

Component placement

Lid attach

Molding
Hard Bake
Lid pick and place
Adhesive / thermal paste dispense

Lab opto

Impression
Placement
Active Alignment
General Lab
Lightwave multi channel system
High performance serial Bert
Lightwave multi channel system
Lightwave component analyzer
DCA-X Oscilloscope

Metal deposition

Vertical sputter

Inspection

Flatness-surface shape measurement
Vision system
Acoustic microscopy
Acoustic microscopy

RESEARCH

Keywords
Category